Diode and heat spreader for solar module

ABSTRACT

Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/370,242, filed Aug. 3, 2010, the entire contents of which are herebyincorporated by reference herein.

TECHNICAL FIELD

Embodiments of the present invention are in the field of renewableenergy and, in particular, arrangements of diodes and heat spreaders forsolar modules.

BACKGROUND

Light-emitting diode (LED) and photovoltaic (PV) devices are two commontypes of optoelectronic devices. Thermal management and assembly ofoptoelectronic systems, such as systems including LED and PV devices,may be considered when evaluating such systems for fabrication anddeployment. For example, the area of systems of devices with cellinterconnects and diodes is one area ripe for improvements in thermalmanagement, stress management, and assembly. Challenges for thefabrication and deployment of such systems include a possible need for alow resistance thermal path in the interconnects, as well as a flexibleaccommodation of cells and diodes coupled to the interconnects.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional view of a backsheet-mounted diodepackage, in accordance with an embodiment of the present invention.

FIG. 2 illustrates a cross-sectional view of an in-laminate diodepackage, in accordance with an embodiment of the present invention.

FIG. 3 illustrates a top plan view of a solar module, in accordance withan embodiment of the present invention.

DETAILED DESCRIPTION

Arrangements of diodes and heat spreaders for solar modules aredescribed herein. In the following description, numerous specificdetails are set forth, such as specific arrangements of diodes and heatspreaders, in order to provide a thorough understanding of embodimentsof the present invention. It will be apparent to one skilled in the artthat embodiments of the present invention may be practiced without thesespecific details. In other instances, well-known fabrication techniques,such as lamination techniques, are not described in detail in order tonot unnecessarily obscure embodiments of the present invention.Furthermore, it is to be understood that the various embodiments shownin the Figures are illustrative representations and are not necessarilydrawn to scale.

Disclosed herein are diodes and heat spreaders for solar modules. In oneembodiment, a solar module includes a backsheet. The solar module alsoincludes a low profile, surface-mount diode disposed above thebacksheet. The solar module also includes a pair of ribboninterconnects, each ribbon interconnect coupled to the low profile,surface-mount diode and penetrating the backsheet. The solar module alsoincludes a heat spreader mounted directly above the low profile,surface-mount diode. In one embodiment a solar module includes abacksheet. The solar module also includes a diode disposed under thebacksheet. The solar module also includes a pair of ribboninterconnects, each ribbon interconnect coupled to the diode andcompletely covered by the backsheet. The solar module also includes aheat spreader mounted directly above the diode.

Certain solar applications such as single-axis concentrator photovoltaic(CPV) systems require a linear arrangement of cells and a large numberof diodes per string to manage higher cell temperatures and opticalnon-uniformities. Diodes are commonly used in photovoltaic systems tobypass cells that are electrically mismatched from others in the string.This mismatch may arise from factors such as shading or performanceinconsistencies. When a cell is mismatched, its operating voltage may bemodified to accommodate the string current, and the cell can be forcedinto reverse bias. This can cause severe heating and system performancedegradation. Diodes are implemented to minimize heating and to optimizepower production in mismatched circumstances.

In a typical photovoltaic module, bypass diodes are electricallyconnected in parallel to a string of cells. The cells are oftenconnected in a serpentine arrangement, which may eliminate the need forlong diode interconnects across the terminals of the string. Instead, aninterconnect tab connected to each terminal is penetrated through amodule backsheet and connected to a diode that is mounted within ajunction box. However, certain applications such as single-axisconcentrator photovoltaic systems require a linear arrangement of cellsand a larger number of diodes per string to manage higher celltemperatures and optical non-uniformities. A centralized junction boxmay require a complicated bypass circuit and many busbars for diodeconnections. Furthermore, the junction box may need to be prohibitivelylarge to accommodate a large number of diodes. It may be preferential tomount bypass diodes in individual packages alongside the strings beingprotected in applications that require a large number of diodes.

In accordance with embodiments of the present invention, a pluralitydiodes is incorporated into a simple, low-profile package that can beinstalled with minimal interference to other laminate features. In anembodiment, diodes are connected to ribbon interconnects that penetratethrough a backsheet along the length of a solar module. The diodes maybe low-profile, surface-mount devices that are soldered directly to theribbons. In an embodiment, in order to manage the heating of the diodes,a heat spreader is mounted directly above the leads of one or more ofthe diodes. In an embodiment, the heat spreader is mounted to thebacksheet with thermal adhesive to provide electrical insulation andthermal conduction. Thus, embodiments of the present invention mayinclude using an integrated approach of mounting a heat spreader onto adiode with thermal adhesive, connecting diode leads, or just a diode,directly to a pair of ribbon interconnects, or fabricating a solarmodule package with a very low profile in order to minimize influenceson surrounding systems (e.g., heat sinks) or to integrate directly intoa laminate.

Embodiments of the present invention may address the need for a simpleand low cost diode package that can be mounted on or within thebacksheet of a photovoltaic module in any frequency. Although such anarrangement has been designed for a linear arrangement of cells, it maybe utilized in any photovoltaic module layout. For example, in thesimplest embodiment, diodes are connected to ribbon interconnects thatpenetrate a backsheet along the length of a module. A heat spreader maybe included but must be electrically insulating on one or both sides toprevent shorting of the diode leads. In one embodiment, a thin copper oraluminum strip coated in a ceramic insulator is used to this end. In anembodiment, the heat spreader is mounted to the backsheet with thermaladhesive to provide electrical insulation and thermal conduction. In anembodiment, the heat spreader also serves to electrically isolate thediode and leads from the surroundings.

In an aspect of the present invention, a package for a solar module mayinclude a surface mount diode disposed above a backsheet of the package.For example, FIG. 1 illustrates a cross-sectional view of abacksheet-mounted diode package, in accordance with an embodiment of thepresent invention.

Referring to FIG. 1, a solar module 100 includes a backsheet 102 and alow profile, surface-mount diode 104 disposed above the backsheet 102. Apair of ribbon interconnects 106 is coupled to the low profile,surface-mount diode 104 and penetrates (at point 108) the backsheet 102.A heat spreader 110 is mounted directly above the low profile,surface-mount diode 104. The low profile aspect of the diode 104 may bein contrast to, e.g., a junction box which is a high profile feature.For example, in an embodiment, the low profile, surface-mount diode 104rises less than 10 millimeters above the backsheet 102.

In accordance with an embodiment of the present invention, the lowprofile, surface-mount diode 104 is attached directly to each of theribbon interconnects, as depicted in FIG. 1. In one embodiment, the lowprofile, surface-mount diode 104 is attached directly to each of theribbon interconnects by a technique such as, but not limited to,bonding, soldering, or welding. In an embodiment, the heat spreader 110is composed of a thin metal strip coated, by a thermally conductivedielectric 112, on at least one side of the metal strip, as is alsodepicted in FIG. 1. In one embodiment, the thermally conductivedielectric 112 is a ceramic insulator. In one embodiment, the heatspreader 110 is mounted to the backsheet 102 by a thermal adhesive 114.In an embodiment, the diode 104, the backsheet 102, the interconnects106 and the heat spreader 110 are mounted above a substrate 116, such asa glass substrate, via an encapsulant 118, as depicted in FIG. 1.

Referring again to FIG. 1, in accordance with an embodiment of thepresent invention, each ribbon interconnect 106 includes four or morebends. A first bend 120 is included for penetration of the backsheet 102(e.g., at location 108), a second bend 122 is included for bringing eachribbon interconnect 106 into a plane of a surface of the backsheet 106,a third bend 124 is included to bring each ribbon interconnect 106vertical, and a fourth bend 126 is included to bring each ribboninterconnect 106 coplanar with one another and for coupling to the lowprofile, surface-mount diode 104. In one embodiment, the fourth bend 126also serves to relieve stress by decoupling the interconnects 106 withina packaging laminate from diode leads outside of the laminate.

Thus, a solar module may be provided where interconnects beyond abacksheet penetration location remain within the boundaries of a heatspreader. In an embodiment, such an arrangement ensures that diode leadsare electrically insulated from an outside environment by thecombination of a thermal adhesive and dielectric layers disposedunderneath the heat spreader. In an embodiment, the arrangement alsominimizes the possibility of the diode leads shorting due to burrs orpoor dielectric coverage near the edges of the heat spreader. Althoughit may be necessary to have dielectric coverage only on the underside ofthe heat spreader, total coverage may be preferred to further reduce thepossibility of exposing voltage to an external environment.

In accordance with an embodiment of the present invention, completelyinsulating a heat spreader eliminates the need to electrically groundthe heat spreader. It may be necessary to mount diode leads as close aspossible to the heat spreader since they are better coupled thermally tothe diode die. That is, in one embodiment, the diode temperature isminimized if there is a low resistance thermal pathway between the diodedie and the heat spreader. This may be a primary motivator for invertingthe diode, as is effectively the arrangement described in associationwith FIG. 1. In one embodiment, a thin layer of thermal adhesive is usedbetween diode leads, or just the diode, and a heat spreader to provide aminimal thermal resistance in this pathway, enabling the diode tomaintain low temperatures when it conducts current in bypass mode.

Although the arrangement described above in association with FIG. 1significantly simplifies a diode packaging scheme, the backsheetpenetrations may in fact be less desirable from a manufacturingstandpoint due to the additional assembly steps needed to create slotsin the backsheet as well as post-lamination steps of attachingcomponents external to the laminate. Instead, if so desired, the diodepackage may be moved inside the laminate. Thus, in another aspect of thepresent invention, a package for a solar module may include a lowprofile diode disposed under a backsheet of the package. For example,FIG. 2 illustrates a cross-sectional view of an in-laminate diodepackage, in accordance with an embodiment of the present invention.

Referring to FIG. 2, a solar module 200 includes a backsheet 202. Adiode 204 is disposed under the backsheet 202. A pair of ribboninterconnects 206 is also included, each ribbon interconnect coupled tothe diode 204 and completely covered by the backsheet 202. A heatspreader 208 is mounted directly above the diode 204. In an embodiment,each of the pair of ribbon interconnects 206 is disposed above the diode204, and the diode 204 is completely covered by the backsheet 202, asdepicted in FIG. 2.

In accordance with an embodiment of the present invention, the diode 204is attached directly to each of the ribbon interconnects 206, asdepicted in FIG. 2. In one embodiment, the diode 204 is attacheddirectly to each of the ribbon interconnects 206 by a technique such as,but not limited to, bonding, soldering, or welding. In an embodiment,the heat spreader 208 is composed of a thin metal strip having bevelededges and coated, by a thermally conductive dielectric 210, on at leastone side of the metal strip, and the heat spreader 208 is completelycovered by the backsheet 202, as is also depicted in FIG. 2. In oneembodiment, the heat spreader 208 is mounted, via the thermallyconductive dielectric 210, to each of the ribbon interconnects 206 witha thermal adhesive 212. In an embodiment, the diode 204, the backsheet202, the interconnects 206 and the heat spreader 210 are mounted above asubstrate 214, such as a glass substrate, via an encapsulant 216.

In another aspect of the present invention, it is to be understood thatnon-uniform backsheet surface profiles can be induced by addingadditional components within a laminate, which may lead to delaminationand backsheet damage. In extreme cases, sharp edges may completelypenetrate the backsheet. In order to minimize these effects, inaccordance with one or more embodiments of the present invention, a heatspreader is fabricated or selected to be as thin as possible and stampedto have beveled edges to create a more gradual increase in thickness toaccommodate a diode package. Accordingly, in an embodiment, the diodeand the heat spreader may be candidates for thickness reduction.

Alternatively, in another embodiment, the encapsulation thickness may bemodified to accommodate the thickness of the heat spreader and diode. Assuch, since the encapsulant may serve to bind the diode andinterconnects, the thermal adhesive may be used only to thermally couplethe diode leads to the heat spreader. Thus, in one embodiment, thermaladhesive need not be included below the diode or diode leads and aroundthe diode package.

FIG. 3 illustrates a top plan view of a solar module, in accordance withanother embodiment of the present invention. Referring to FIG. 3, aportion 300 of a solar module includes a diode 304 mounted above orbelow a backsheet 302. A pair of interconnects 306 is included with alaminate including backsheet 302. A heat spreader 308 is disposed abovethe diode 304 and a thermal adhesive 310 is disposed between the heatspreader 308 and the diode 304. In an embodiment, the arrangementdepicted in FIG. 3 is suitable for backsheet-mounted packages (andincludes backsheet penetrations 312, if necessary), similar to thearrangement described in association with FIG. 1. In another embodiment,however, the arrangement depicted in FIG. 3 is also suitable forin-laminate packages, similar to the arrangement described inassociation with FIG. 2. Referring again to FIG. 2, in an embodiment,the heat spreader 308 substantially exceeds the width of the diode 304and interconnects 306 to maximize heat spreading. The heat spreader 308may be shaped or sized as appropriate for the application and does notnecessarily need to be rectangular as shown.

In another aspect of the present invention, the above described solarmodules may be included in larger solar systems including many suchsolar modules. For example, in accordance with an embodiment of thepresent invention, a solar system includes a plurality of solar cells. Abacksheet covers the plurality of solar cells. A plurality of lowprofile, surface-mount diodes is coupled to the plurality of solarcells. Each low profile, surface-mount diode is disposed above thebacksheet. For each low profile, surface-mount diode, also included is arespective pair of ribbon interconnects. Each ribbon interconnect iscoupled to the low profile, surface-mount diode and penetrating thebacksheet. Also included for each low profile, surface-mount diode is arespective heat spreader mounted directly above the low profile,surface-mount diode. Thus, the solar system includes a plurality ofsolar modules similar to the solar module described in association withFIG. 1.

In an embodiment, each low profile, surface-mount diode rises less than10 millimeters above the backsheet. In an embodiment, each low profile,surface-mount diode is attached directly to each ribbon interconnect ofthe respective pair of ribbon interconnects. In an embodiment, therespective heat spreader is composed of a thin metal strip coated, by athermally conductive dielectric, on at least one side of the metalstrip. In one such embodiment, the respective heat spreader is mountedto the backsheet with a thermal adhesive. In an embodiment, each ribboninterconnect of the respective pair of ribbon interconnects includesfour or more bends, a first bend for penetration of the backsheet, asecond bend for bringing each ribbon interconnect into a plane of asurface of the backsheet, a third bend to bring each ribbon interconnectvertical, and a fourth bend to bring each ribbon interconnect of therespective pair of ribbon interconnects coplanar with one another andfor coupling to the low profile, surface-mount diode.

In another example, in accordance with another embodiment of the presentinvention, a solar system includes a plurality of solar cells. Abacksheet covers the plurality of solar cells. A plurality of diodes iscoupled to the plurality of solar cells, each diode disposed under thebacksheet. For each diode, also included is a respective pair of ribboninterconnects. Each ribbon interconnect is coupled to the diode andcompletely covered by the backsheet. Also included for each diode is arespective heat spreader mounted directly above the diode. Thus, thesolar system includes a plurality of solar modules similar to the solarmodule described in association with FIG. 2.

In an embodiment, each ribbon interconnect of the respective pair ofribbon interconnects is above the diode, and the diode is completelycovered by the backsheet. In one such embodiment, the diode is attacheddirectly to each ribbon interconnect of the respective pair of ribboninterconnects. In an embodiment, the respective heat spreader iscomposed of a thin metal strip having beveled edges and coated, by athermally conductive dielectric, on at least one side of the metalstrip. The respective heat spreader is completely covered by thebacksheet. In one such embodiment, the respective heat spreader ismounted, via the thermally conductive dielectric, to the respective pairof ribbon interconnects with a thermal adhesive.

It is to be understood that the above described arrangements for solarmodules and solar systems may provide benefits additional to thosedescribed above. For example, in one embodiment, by placing diodes incell laminates, J-shaped busbars need not be included in a solar modulepackage. In another embodiment, since the diodes are included in a celllaminate, needs for specialized or additional packaging to accommodatediodes are no longer required. In another embodiment, interconnectsbetween diodes and a cell laminate are substantially, if not entirely,maintained within the laminate which aids in prevention of interconnectburring or shorting. Also, in one embodiment, since less, if not all, ofthe material of the interconnects is no longer exposed, theinterconnects may not require electrical grounding.

Thus, arrangements of diodes and heat spreaders for solar modules havebeen disclosed. In accordance with an embodiment of the presentinvention, a solar module includes a backsheet. A low profile,surface-mount diode is disposed above the backsheet. A pair of ribboninterconnects, each ribbon interconnect is coupled to the low profile,surface-mount diode and penetrates the backsheet. A heat spreader ismounted directly above the low profile, surface-mount diode. In oneembodiment, the low profile, surface-mount diode rises less than 10millimeters above the backsheet. In accordance with another embodimentof the present invention, a solar module includes a backsheet. A diodeis disposed under the backsheet. Each ribbon interconnect of a pair ofribbon interconnects is coupled to the diode and completely covered bythe backsheet. A heat spreader is mounted directly above the diode. Inone embodiment, each of the pair of ribbon interconnects is above thediode, and the diode is completely covered by the backsheet.

What is claimed is:
 1. A solar system, comprising: a plurality of solarcells; a backsheet covering the plurality of solar cells, the backsheethaving a top surface and a bottom surface opposite the top surface, thebacksheet having a thickness defined at least by the top surface and thebottom surface; and a plurality of low profile, surface-mount diodescoupled to the plurality of solar cells, each low profile, surface-mountdiode disposed above the top surface of the backsheet such that the topsurface of the backsheet faces the low profile, surface-mount diode andthe bottom surface of the backsheet faces away from the low profile,surface-mount diode, and for each low profile, surface-mount diode: arespective pair of ribbon interconnects, each ribbon interconnectcoupled to the low profile, surface-mount diode and penetrating thebacksheet through the thickness of the backsheet, each ribboninterconnect comprising a plurality of segments angled relative to oneanother such that at least one segment is disposed below the bottomsurface of the backsheet and at least one segment is disposed above thelow profile, surface-mount diode; and a respective heat spreader mounteddirectly above the low profile, surface-mount diode.
 2. The solar systemof claim 1, wherein each low profile, surface-mount diode rises lessthan 10 millimeters above the backsheet.
 3. The solar system of claim 1,wherein each low profile, surface-mount diode is attached directly toeach ribbon interconnect of the respective pair of ribbon interconnects.4. The solar system of claim 1, wherein the respective heat spreadercomprises a thin metal strip coated, by a thermally conductivedielectric, on at least one side of the metal strip.
 5. The solar systemof claim 4, wherein the respective heat spreader is mounted to thebacksheet with a thermal adhesive.
 6. The solar system of claim 1,wherein each ribbon interconnect of the respective pair of ribboninterconnects comprises four or more bends, a first bend for penetrationof the backsheet, a second bend for bringing each ribbon interconnectinto a plane of a surface of the backsheet, a third bend to bring eachribbon interconnect vertical, and a fourth bend to bring each ribboninterconnect of the respective pair of ribbon interconnects coplanarwith one another and for coupling to the low profile, surface-mountdiode.
 7. A solar module, comprising: a backsheet having a top surfaceand a bottom surface opposite the top surface, the backsheet having athickness defined at least by the top surface and the bottom surface; alow profile, surface-mount diode disposed above the top surface of thebacksheet; a pair of ribbon interconnects, each ribbon interconnectcoupled to the low profile, surface-mount diode and penetrating thebacksheet through the thickness of the backsheet, each ribboninterconnect comprising a plurality of segments angled relative to oneanother such that a first segment is disposed below the backsheetoriented in a first direction and a second segment passes through thethickness of the backsheet in a second direction that is transverse tothe first direction; and a heat spreader mounted directly above the lowprofile, surface-mount diode.
 8. The solar module of claim 7, whereinthe low profile, surface-mount diode rises less than 10 millimetersabove the backsheet.
 9. The solar module of claim 7, wherein the lowprofile, surface-mount diode is attached directly to each of the ribboninterconnects.
 10. The solar module of claim 7, wherein the heatspreader comprises a thin metal strip coated, by a thermally conductivedielectric, on at least one side of the metal strip.
 11. The solarmodule of claim 10, wherein the heat spreader is mounted to thebacksheet with a thermal adhesive.
 12. The solar module of claim 7,wherein each ribbon interconnect further comprises a third segment, afourth segment and a fifth segment, wherein each of the pair of ribboninterconnects comprises four or more bends, a first bend between thefirst segment and the second segment for penetration of the backsheet, asecond bend between the second segment and the third segment forbringing each ribbon interconnect into a plane of the top surface of thebacksheet, a third bend between the third segment and the fourth segmentto bring each ribbon interconnect vertical, and a fourth bend betweenthe fourth segment and the fifth segment to bring each ribboninterconnect coplanar with one another and for coupling to the lowprofile, surface-mount diode.
 13. The solar system of claim 6, whereineach ribbon interconnect includes at least a first segment, a secondsegment, a third segment, a fourth segment and a fifth segment, whereinthe first segment is disposed below the bottom surface of the backsheet,wherein the second segment passes through the thickness of the backsheetbetween the first bend and the second bend and is transverse to thefirst segment, wherein the third segment is disposed above the topsurface of the backsheet between the second bend and the third bend,wherein the fourth segment is disposed between the third bend and thefourth bend, and wherein the fifth segment is disposed above the lowprofile, surface-mount diode.
 14. The solar module of claim 7, whereinat least one segment of each ribbon interconnect is disposed above thelow profile, surface-mount diode on a side of the low profile,surface-mount diode opposite the backsheet.